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fixed HQFP ground pads

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This commit is contained in:
Mario Hüttel
2016-12-13 20:26:31 +01:00
parent c0ee16d86a
commit 0d0e38c1b7
2 changed files with 72 additions and 72 deletions
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8
footprints/pretty/smd.pretty/HQFP-100_14x14mm_Pitch0.5mm_handsoldering.kicad_mod
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@@ -1,11 +1,11 @@
(module HQFP-100_14x14mm_Pitch0.5mm_handsoldering (layer F.Cu) (tedit 584D7D4D)
(module HQFP-100_14x14mm_Pitch0.5mm_handsoldering (layer F.Cu) (tedit 584FF58E)
(descr "100-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -9.45) (layer F.SilkS)
(fp_text reference U401 (at 0 -9.45) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TQFP-100_14x14mm_Pitch0.5mm (at 0 9.45) (layer F.Fab)
(fp_text value TFP401 (at 0 9.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.175 -6.45) (end -8.45 -6.45) (layer F.SilkS) (width 0.15))
@@ -129,7 +129,7 @@
(pad 3 smd rect (at -7.7 -5) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -7.7 -5.5) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -7.7 -6) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 101 thru_hole rect (at 0 0) (size 5.2 5.2) (drill 3) (layers *.Cu *.Mask))
(pad 101 thru_hole rect (at 0 0) (size 5.3 5.3) (drill 3) (layers *.Cu *.Mask))
(model Housings_QFP.3dshapes/TQFP-100_14x14mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))