handsoldering HQFP with thermal pads. Changed TFP chips
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@@ -37,6 +37,7 @@ X OVDD 29 900 -1150 200 L 50 50 1 1 W
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X DGND 39 -200 -200 200 R 50 50 1 1 W
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X AGND 79 -200 -500 200 R 50 50 1 1 W
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X AGND 89 -200 -800 200 R 50 50 1 1 W
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X PAD 101 350 -1900 200 U 50 50 1 1 W
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S 1150 -4450 0 0 2 1 0 f
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X DFO 1 -200 -1700 200 R 50 50 2 1 I
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X ~PD 2 -200 -1300 200 R 50 50 2 1 I I
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@@ -181,6 +182,7 @@ X TGND 32 -200 -800 200 R 50 50 2 1 W
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X TVDD 23 900 -600 200 L 50 50 2 1 W
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X DVDD 33 900 -300 200 L 50 50 2 1 W
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X DGND 64 -200 -300 200 R 50 50 2 1 W
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X PAD 65 350 -1200 200 U 50 50 2 1 W
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X DGND 16 -200 -100 200 R 50 50 2 1 W
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X TGND 26 -200 -700 200 R 50 50 2 1 W
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X PGND 17 -200 -450 200 R 50 50 2 1 W
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