Mario Hüttel
96b5213200
Fooprints: * SOIC-20W_ThermalPad * ALPS Stereo Poti * Lumberg THT Audio Jack Schmeatic: * Change TPA6120 in TI lib: add thermal pad as pin
54 lines
3.4 KiB
Plaintext
54 lines
3.4 KiB
Plaintext
(module SOIC-20W_ThermalPad (layer F.Cu) (tedit 59762C02)
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(descr "20-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SOIC 1.27")
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(attr smd)
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(fp_text reference REF** (at 0 -7.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value SOIC-20W (at 0 7.5) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start -3.875 -6.325) (end -5.675 -6.325) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.875 6.575) (end 3.875 6.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.875 -6.575) (end 3.875 -6.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.875 6.575) (end -3.875 6.24) (layer F.SilkS) (width 0.15))
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(fp_line (start 3.875 6.575) (end 3.875 6.24) (layer F.SilkS) (width 0.15))
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(fp_line (start 3.875 -6.575) (end 3.875 -6.24) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.875 -6.575) (end -3.875 -6.325) (layer F.SilkS) (width 0.15))
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(fp_line (start -5.95 6.75) (end 5.95 6.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5.95 -6.75) (end 5.95 -6.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.95 -6.75) (end 5.95 6.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5.95 -6.75) (end -5.95 6.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 -5.4) (end -2.75 -6.4) (layer F.Fab) (width 0.15))
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(fp_line (start -3.75 6.4) (end -3.75 -5.4) (layer F.Fab) (width 0.15))
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(fp_line (start 3.75 6.4) (end -3.75 6.4) (layer F.Fab) (width 0.15))
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(fp_line (start 3.75 -6.4) (end 3.75 6.4) (layer F.Fab) (width 0.15))
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(fp_line (start -2.75 -6.4) (end 3.75 -6.4) (layer F.Fab) (width 0.15))
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(pad 20 smd rect (at 4.7 -5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 19 smd rect (at 4.7 -4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 18 smd rect (at 4.7 -3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 4.7 -1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd rect (at 4.7 -0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd rect (at 4.7 0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd rect (at 4.7 1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 4.7 3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at 4.7 4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at 4.7 5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at -4.7 5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at -4.7 4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at -4.7 3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at -4.7 1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at -4.7 0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -4.7 -0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -4.7 -1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -4.7 -3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -4.7 -4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 1 smd rect (at -4.7 -5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 21 smd rect (at 0 0) (size 3 4) (layers F.Cu F.Paste F.Mask))
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(model Housings_SOIC.3dshapes/SOIC-20_7.5x12.8mm_Pitch1.27mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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