mhu/microscope-ring-light
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Final changes in layout

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This commit is contained in:
Mario Hüttel 2021-02-15 21:10:24 +01:00
parent 9cea170528
commit 0ed3e0fbac
1 changed files with 16 additions and 16 deletions
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32
pcb/microscope-ring-light.kicad_pcb
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@ -69,7 +69,7 @@
(visible_elements FFFFFF7F)
(pcbplotparams
(layerselection 0x010fc_ffffffff)
(usegerberextensions false)
(usegerberextensions true)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
@ -91,9 +91,9 @@
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 1)
(drillshape 0)
(scaleselection 1)
(outputdirectory ""))
(outputdirectory "gerber/"))
)
(net 0 "")
@ -4908,9 +4908,9 @@
(fp_text user %R (at 0 0 45) (layer B.Fab)
(effects (font (size 0.8 0.8) (thickness 0.12)) (justify mirror))
)
(pad 2 smd roundrect (at 1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 2 smd roundrect (at 1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 1 GND) (zone_connect 2))
(pad 1 smd roundrect (at -1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 6 +5V) (zone_connect 2))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -4944,9 +4944,9 @@
(fp_text user %R (at 0 0 90) (layer B.Fab)
(effects (font (size 0.8 0.8) (thickness 0.12)) (justify mirror))
)
(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 1 GND))
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 6 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -4982,7 +4982,7 @@
)
(pad 2 smd roundrect (at 1.475001 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217)
(net 1 GND) (zone_connect 2))
(pad 1 smd roundrect (at -1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 6 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -5018,7 +5018,7 @@
)
(pad 2 smd roundrect (at 1.475001 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217)
(net 1 GND) (zone_connect 2))
(pad 1 smd roundrect (at -1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 45) (size 1.15 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 6 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -5196,9 +5196,9 @@
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.12)))
)
(pad 2 smd roundrect (at 1.475 0 270) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 2 smd roundrect (at 1.475 0 270) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 1 GND))
(pad 1 smd roundrect (at -1.475 0 270) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 270) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 5 +12V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -6777,7 +6777,7 @@
(segment (start 120 34.5) (end 118.9 33.4) (width 0.8) (layer B.Cu) (net 60))
(segment (start 125.753863 72.566363) (end 125.7125 72.525) (width 0.3) (layer B.Cu) (net 62))
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 0) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 602AD5F2) (hatch edge 0.508)
(connect_pads (clearance 0.3))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -8488,7 +8488,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 600C231C) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 602AD5EF) (hatch edge 0.508)
(connect_pads (clearance 0.3))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -9850,7 +9850,7 @@
)
)
)
(zone (net 6) (net_name +5V) (layer B.Cu) (tstamp 0) (hatch edge 0.508)
(zone (net 6) (net_name +5V) (layer B.Cu) (tstamp 602AD5EC) (hatch edge 0.508)
(priority 1)
(connect_pads (clearance 0.3))
(min_thickness 0.254)
@ -9936,7 +9936,7 @@
)
)
)
(zone (net 5) (net_name +12V) (layer B.Cu) (tstamp 0) (hatch edge 0.508)
(zone (net 5) (net_name +12V) (layer B.Cu) (tstamp 602AD5E9) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.3))
(min_thickness 0.3)
@ -9957,7 +9957,7 @@
)
)
)
(zone (net 5) (net_name +12V) (layer B.Cu) (tstamp 0) (hatch edge 0.508)
(zone (net 5) (net_name +12V) (layer B.Cu) (tstamp 602AD5E6) (hatch edge 0.508)
(priority 1)
(connect_pads (clearance 0.3))
(min_thickness 0.254)