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This commit is contained in:
Mario Hüttel 2020-12-13 18:50:32 +01:00
parent f1de06b8b1
commit 2f53449877
2 changed files with 69 additions and 42 deletions
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105
reflow-oven-control-pcb.kicad_pcb
View File

@ -3,9 +3,9 @@
(general
(thickness 1.6)
(drawings 151)
(tracks 1901)
(tracks 1898)
(zones 0)
(modules 173)
(modules 174)
(nets 150)
)
@ -34,7 +34,7 @@
)
(setup
(last_trace_width 0.6)
(last_trace_width 0.25)
(user_trace_width 0.3)
(user_trace_width 0.4)
(user_trace_width 0.6)
@ -63,13 +63,12 @@
(mod_text_width 0.15)
(pad_size 1.15 1.8)
(pad_drill 0)
(pad_to_mask_clearance 0.051)
(solder_mask_min_width 0.25)
(pad_to_mask_clearance 0)
(aux_axis_origin 13 13)
(grid_origin 13 13)
(visible_elements FFFFFF7F)
(pcbplotparams
(layerselection 0x010fc_ffffffff)
(layerselection 0x010f0_ffffffff)
(usegerberextensions true)
(usegerberattributes false)
(usegerberadvancedattributes false)
@ -419,6 +418,37 @@
(add_net /N_IN)
)
(module shimatta_tht:BV-EI-303-2010 locked (layer F.Cu) (tedit 5FC3F18F) (tstamp 5FD7202A)
(at 70 35.5 180)
(path /5D6EA3F7)
(fp_text reference T1 (at 12 17.5) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value BV-EI-303-2050 (at 0 -0.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 13.97 -16.51) (end -13.97 -16.51) (layer F.Fab) (width 0.12))
(fp_line (start 13.97 16.51) (end 13.97 -16.51) (layer F.Fab) (width 0.12))
(fp_line (start -13.97 16.51) (end 13.97 16.51) (layer F.Fab) (width 0.12))
(fp_line (start -13.97 -16.51) (end -13.97 16.51) (layer F.Fab) (width 0.12))
(fp_line (start -13.97 16.51) (end -13.97 -16.51) (layer F.CrtYd) (width 0.12))
(fp_line (start 13.97 16.51) (end -13.97 16.51) (layer F.CrtYd) (width 0.12))
(fp_line (start 13.97 -16.51) (end 13.97 16.51) (layer F.CrtYd) (width 0.12))
(fp_line (start -13.97 -16.51) (end 13.97 -16.51) (layer F.CrtYd) (width 0.12))
(fp_line (start -13.9 -16.4) (end 13.9 -16.4) (layer F.SilkS) (width 0.15))
(fp_line (start -13.9 -16.4) (end -13.9 16.4) (layer F.SilkS) (width 0.15))
(fp_line (start -13.9 16.4) (end 13.9 16.4) (layer F.SilkS) (width 0.15))
(fp_line (start 13.9 -16.4) (end 13.9 16.4) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole circle (at -10 10 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
(net 23 /N_IN))
(pad 2 thru_hole circle (at -10 -10 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
(net 21 /L_Trafo))
(pad 3 thru_hole circle (at 10 5 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
(net 65 "Net-(F2-Pad2)"))
(pad 4 thru_hole circle (at 10 -5 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
(net 62 "Net-(D1-Pad2)"))
)
(module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5F68FEEE) (tstamp 5FD64B98)
(at 67.25 94 270)
(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
@ -949,7 +979,7 @@
)
(pad 2 smd roundrect (at 1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
(net 2 GND) (zone_connect 2))
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 3 +8V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
(at (xyz 0 0 0))
@ -1307,7 +1337,7 @@
(net 33 /Controller/LCD_VO))
(pad 3 thru_hole circle (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
(net 45 +5VL))
(pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.147059)
(pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.1470588235294118)
(net 2 GND))
(model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x05_P2.54mm_Vertical.wrl
(at (xyz 0 0 0))
@ -3939,9 +3969,9 @@
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.5 0.5) (thickness 0.08)))
)
(pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 4 +3V3))
(pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 44 /Controller/VDDA))
(model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
(at (xyz 0 0 0))
@ -4038,7 +4068,7 @@
(tags capacitor)
(path /5D77EC9D/5D77625F)
(attr smd)
(fp_text reference C39 (at 0 -1.35 90) (layer B.SilkS)
(fp_text reference C39 (at 3.05 0.05 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 100n (at 0 -1.43 90) (layer B.Fab)
@ -5133,7 +5163,7 @@
(net 2 GND))
(pad 3 thru_hole circle (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
(net 2 GND))
(pad 1 thru_hole roundrect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.147059)
(pad 1 thru_hole roundrect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.1470588235294118)
(net 2 GND))
(model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x05_P2.54mm_Horizontal.wrl
(at (xyz 0 0 0))
@ -5438,7 +5468,7 @@
)
(pad 2 smd roundrect (at 1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
(net 2 GND) (zone_connect 1) (thermal_width 1.5))
(pad 1 smd roundrect (at -1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 4 +3V3))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -5472,9 +5502,9 @@
(fp_text user %R (at 0 0 90) (layer B.Fab)
(effects (font (size 0.8 0.8) (thickness 0.12)) (justify mirror))
)
(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 2 GND))
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
(net 4 +3V3))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
(at (xyz 0 0 0))
@ -5567,7 +5597,7 @@
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.12)))
)
(pad 2 smd roundrect (at 1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 2 smd roundrect (at 1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 2 GND))
(pad 1 smd roundrect (at -1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
(net 4 +3V3) (zone_connect 1) (thermal_width 1.5))
@ -5641,7 +5671,7 @@
)
(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
(net 2 GND) (zone_connect 2))
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 3 +8V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
(at (xyz 0 0 0))
@ -5677,7 +5707,7 @@
)
(pad 2 smd roundrect (at 1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
(net 2 GND) (zone_connect 1) (thermal_width 1.5))
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 3 +8V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
(at (xyz 0 0 0))
@ -5713,7 +5743,7 @@
)
(pad 2 smd roundrect (at 1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
(net 2 GND) (zone_connect 1) (thermal_width 1.5))
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
(net 3 +8V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
(at (xyz 0 0 0))
@ -10028,9 +10058,6 @@
(via (at 28.75 19.75) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
(via (at 29.5 19.75) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
(via (at 30.25 19.75) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
(via (at 36.5 84.5) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
(via (at 35.5 84.5) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
(via (at 37.5 84.5) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
(segment (start 42 107.4) (end 41.4 107.4) (width 0.25) (layer F.Cu) (net 2))
(segment (start 41.19999 107.19999) (end 41.19999 104.80001) (width 0.25) (layer F.Cu) (net 2))
(segment (start 41.4 107.4) (end 41.19999 107.19999) (width 0.25) (layer F.Cu) (net 2))
@ -11490,7 +11517,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FC2D268) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FD71E9B) (hatch edge 0.508)
(priority 2)
(connect_pads yes (clearance 0.25))
(min_thickness 0.254)
@ -11515,7 +11542,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FC2D265) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FD71E98) (hatch edge 0.508)
(connect_pads yes (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -11561,7 +11588,7 @@
)
)
)
(zone (net 0) (net_name "") (layer B.Cu) (tstamp 5FC2D262) (hatch edge 0.508)
(zone (net 0) (net_name "") (layer B.Cu) (tstamp 5FD71E95) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.25))
(min_thickness 0.254)
@ -11573,7 +11600,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FC2D25F) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FD71E92) (hatch edge 0.508)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -12732,7 +12759,7 @@
)
)
)
(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 5FC2D25C) (hatch edge 0.508)
(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 5FD71E8F) (hatch edge 0.508)
(priority 2)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
@ -12750,7 +12777,7 @@
)
)
)
(zone (net 4) (net_name +3V3) (layer B.Cu) (tstamp 5FC2D259) (hatch edge 0.508)
(zone (net 4) (net_name +3V3) (layer B.Cu) (tstamp 5FD71E8C) (hatch edge 0.508)
(priority 1)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
@ -12768,7 +12795,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FC2D256) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FD71E89) (hatch edge 0.508)
(priority 2)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
@ -13219,7 +13246,7 @@
)
)
)
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FC2D253) (hatch edge 0.508)
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FD71E86) (hatch edge 0.508)
(priority 1)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
@ -13419,7 +13446,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FC2D250) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FD71E83) (hatch edge 0.508)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -15219,7 +15246,7 @@
)
)
)
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FCB29E1) (hatch edge 0.508)
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FD71E80) (hatch edge 0.508)
(priority 1)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
@ -15324,7 +15351,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FC2D24A) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FD71E7D) (hatch edge 0.508)
(priority 2)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
@ -15526,7 +15553,7 @@
)
)
)
(zone (net 3) (net_name +8V) (layer F.Cu) (tstamp 5FC2D247) (hatch edge 0.508)
(zone (net 3) (net_name +8V) (layer F.Cu) (tstamp 5FD71E7A) (hatch edge 0.508)
(priority 3)
(connect_pads (clearance 0.4))
(min_thickness 0.254)
@ -15653,7 +15680,7 @@
)
)
)
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FC2D244) (hatch edge 0.508)
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FD71E77) (hatch edge 0.508)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -15668,7 +15695,7 @@
)
)
)
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FC2D241) (hatch edge 0.508)
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FD71E74) (hatch edge 0.508)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -15683,7 +15710,7 @@
)
)
)
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FC2D23E) (hatch edge 0.508)
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FD71E71) (hatch edge 0.508)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -15698,7 +15725,7 @@
)
)
)
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FC2D23B) (hatch edge 0.508)
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FD71E6E) (hatch edge 0.508)
(connect_pads (clearance 0.25))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -15713,7 +15740,7 @@
)
)
)
(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 0) (hatch edge 0.508)
(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 5FD71E6B) (hatch edge 0.508)
(priority 3)
(connect_pads (clearance 0.25))
(min_thickness 0.254)

6
reflow-oven-control-pcb.pro
View File

@ -1,4 +1,4 @@
update=Fri 27 Nov 2020 09:45:33 PM CET
update=Sun 13 Dec 2020 06:44:17 PM CET
version=1
last_client=kicad
[general]
@ -74,8 +74,8 @@ OthersTextSizeH=1
OthersTextSizeThickness=0.15
OthersTextItalic=0
OthersTextUpright=1
SolderMaskClearance=0.051
SolderMaskMinWidth=0.25
SolderMaskClearance=0
SolderMaskMinWidth=0
SolderPasteClearance=0
SolderPasteRatio=-0
[pcbnew/Layer.F.Cu]