Export gerbers
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parent
f1de06b8b1
commit
2f53449877
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@ -3,9 +3,9 @@
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(general
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||||
(thickness 1.6)
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||||
(drawings 151)
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(tracks 1901)
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||||
(tracks 1898)
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(zones 0)
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(modules 173)
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(modules 174)
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(nets 150)
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)
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@ -34,7 +34,7 @@
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)
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||||
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(setup
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(last_trace_width 0.6)
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||||
(last_trace_width 0.25)
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||||
(user_trace_width 0.3)
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(user_trace_width 0.4)
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(user_trace_width 0.6)
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@ -63,13 +63,12 @@
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(mod_text_width 0.15)
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(pad_size 1.15 1.8)
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(pad_drill 0)
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(pad_to_mask_clearance 0.051)
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||||
(solder_mask_min_width 0.25)
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(pad_to_mask_clearance 0)
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(aux_axis_origin 13 13)
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(grid_origin 13 13)
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||||
(visible_elements FFFFFF7F)
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||||
(pcbplotparams
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(layerselection 0x010fc_ffffffff)
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(layerselection 0x010f0_ffffffff)
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(usegerberextensions true)
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(usegerberattributes false)
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(usegerberadvancedattributes false)
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@ -419,6 +418,37 @@
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(add_net /N_IN)
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)
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(module shimatta_tht:BV-EI-303-2010 locked (layer F.Cu) (tedit 5FC3F18F) (tstamp 5FD7202A)
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(at 70 35.5 180)
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(path /5D6EA3F7)
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(fp_text reference T1 (at 12 17.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value BV-EI-303-2050 (at 0 -0.5) (layer F.Fab)
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||||
(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 13.97 -16.51) (end -13.97 -16.51) (layer F.Fab) (width 0.12))
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(fp_line (start 13.97 16.51) (end 13.97 -16.51) (layer F.Fab) (width 0.12))
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||||
(fp_line (start -13.97 16.51) (end 13.97 16.51) (layer F.Fab) (width 0.12))
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(fp_line (start -13.97 -16.51) (end -13.97 16.51) (layer F.Fab) (width 0.12))
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||||
(fp_line (start -13.97 16.51) (end -13.97 -16.51) (layer F.CrtYd) (width 0.12))
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(fp_line (start 13.97 16.51) (end -13.97 16.51) (layer F.CrtYd) (width 0.12))
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(fp_line (start 13.97 -16.51) (end 13.97 16.51) (layer F.CrtYd) (width 0.12))
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(fp_line (start -13.97 -16.51) (end 13.97 -16.51) (layer F.CrtYd) (width 0.12))
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(fp_line (start -13.9 -16.4) (end 13.9 -16.4) (layer F.SilkS) (width 0.15))
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(fp_line (start -13.9 -16.4) (end -13.9 16.4) (layer F.SilkS) (width 0.15))
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(fp_line (start -13.9 16.4) (end 13.9 16.4) (layer F.SilkS) (width 0.15))
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(fp_line (start 13.9 -16.4) (end 13.9 16.4) (layer F.SilkS) (width 0.15))
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(pad 1 thru_hole circle (at -10 10 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
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(net 23 /N_IN))
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(pad 2 thru_hole circle (at -10 -10 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
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(net 21 /L_Trafo))
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(pad 3 thru_hole circle (at 10 5 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
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(net 65 "Net-(F2-Pad2)"))
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(pad 4 thru_hole circle (at 10 -5 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
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(net 62 "Net-(D1-Pad2)"))
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)
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(module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5F68FEEE) (tstamp 5FD64B98)
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(at 67.25 94 270)
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(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
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@ -949,7 +979,7 @@
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)
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(pad 2 smd roundrect (at 1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
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(net 2 GND) (zone_connect 2))
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(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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(net 3 +8V))
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(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
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(at (xyz 0 0 0))
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@ -1307,7 +1337,7 @@
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(net 33 /Controller/LCD_VO))
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(pad 3 thru_hole circle (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
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(net 45 +5VL))
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(pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.147059)
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(pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.1470588235294118)
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(net 2 GND))
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(model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x05_P2.54mm_Vertical.wrl
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(at (xyz 0 0 0))
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@ -3939,9 +3969,9 @@
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.08)))
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)
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(pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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(pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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(net 4 +3V3))
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(pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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(pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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(net 44 /Controller/VDDA))
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(model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
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(at (xyz 0 0 0))
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@ -4038,7 +4068,7 @@
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(tags capacitor)
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(path /5D77EC9D/5D77625F)
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(attr smd)
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(fp_text reference C39 (at 0 -1.35 90) (layer B.SilkS)
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(fp_text reference C39 (at 3.05 0.05 90) (layer B.SilkS)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
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)
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(fp_text value 100n (at 0 -1.43 90) (layer B.Fab)
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@ -5133,7 +5163,7 @@
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(net 2 GND))
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(pad 3 thru_hole circle (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
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(net 2 GND))
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||||
(pad 1 thru_hole roundrect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.147059)
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||||
(pad 1 thru_hole roundrect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.1470588235294118)
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(net 2 GND))
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||||
(model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x05_P2.54mm_Horizontal.wrl
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(at (xyz 0 0 0))
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@ -5438,7 +5468,7 @@
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)
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(pad 2 smd roundrect (at 1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
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(net 2 GND) (zone_connect 1) (thermal_width 1.5))
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(pad 1 smd roundrect (at -1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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||||
(pad 1 smd roundrect (at -1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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(net 4 +3V3))
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||||
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
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(at (xyz 0 0 0))
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@ -5472,9 +5502,9 @@
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(fp_text user %R (at 0 0 90) (layer B.Fab)
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(effects (font (size 0.8 0.8) (thickness 0.12)) (justify mirror))
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)
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(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
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(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
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(net 2 GND))
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||||
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
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(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.2173904347826087)
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(net 4 +3V3))
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||||
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
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(at (xyz 0 0 0))
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@ -5567,7 +5597,7 @@
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.8 0.8) (thickness 0.12)))
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)
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(pad 2 smd roundrect (at 1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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||||
(pad 2 smd roundrect (at 1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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(net 2 GND))
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||||
(pad 1 smd roundrect (at -1.475 0 180) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
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(net 4 +3V3) (zone_connect 1) (thermal_width 1.5))
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@ -5641,7 +5671,7 @@
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)
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(pad 2 smd roundrect (at 1.475 0 90) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
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||||
(net 2 GND) (zone_connect 2))
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||||
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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||||
(pad 1 smd roundrect (at -1.475 0 90) (size 1.15 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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||||
(net 3 +8V))
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||||
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
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(at (xyz 0 0 0))
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||||
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@ -5677,7 +5707,7 @@
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|||
)
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||||
(pad 2 smd roundrect (at 1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
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||||
(net 2 GND) (zone_connect 1) (thermal_width 1.5))
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||||
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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||||
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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||||
(net 3 +8V))
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||||
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
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||||
(at (xyz 0 0 0))
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||||
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@ -5713,7 +5743,7 @@
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|||
)
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||||
(pad 2 smd roundrect (at 1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217)
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||||
(net 2 GND) (zone_connect 1) (thermal_width 1.5))
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||||
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
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||||
(pad 1 smd roundrect (at -1.475 0) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2173904347826087)
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(net 3 +8V))
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||||
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
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(at (xyz 0 0 0))
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@ -10028,9 +10058,6 @@
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(via (at 28.75 19.75) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
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(via (at 29.5 19.75) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
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(via (at 30.25 19.75) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
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(via (at 36.5 84.5) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
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(via (at 35.5 84.5) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
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(via (at 37.5 84.5) (size 0.5) (drill 0.3) (layers F.Cu B.Cu) (net 2))
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(segment (start 42 107.4) (end 41.4 107.4) (width 0.25) (layer F.Cu) (net 2))
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(segment (start 41.19999 107.19999) (end 41.19999 104.80001) (width 0.25) (layer F.Cu) (net 2))
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(segment (start 41.4 107.4) (end 41.19999 107.19999) (width 0.25) (layer F.Cu) (net 2))
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@ -11490,7 +11517,7 @@
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)
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)
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)
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(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FC2D268) (hatch edge 0.508)
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(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FD71E9B) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0.25))
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(min_thickness 0.254)
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@ -11515,7 +11542,7 @@
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)
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)
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)
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(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FC2D265) (hatch edge 0.508)
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(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FD71E98) (hatch edge 0.508)
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(connect_pads yes (clearance 0.25))
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(min_thickness 0.254)
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(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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@ -11561,7 +11588,7 @@
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)
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)
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)
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(zone (net 0) (net_name "") (layer B.Cu) (tstamp 5FC2D262) (hatch edge 0.508)
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(zone (net 0) (net_name "") (layer B.Cu) (tstamp 5FD71E95) (hatch edge 0.508)
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(priority 1)
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(connect_pads yes (clearance 0.25))
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(min_thickness 0.254)
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@ -11573,7 +11600,7 @@
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)
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)
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)
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(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FC2D25F) (hatch edge 0.508)
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(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FD71E92) (hatch edge 0.508)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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||||
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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@ -12732,7 +12759,7 @@
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)
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)
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)
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(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 5FC2D25C) (hatch edge 0.508)
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(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 5FD71E8F) (hatch edge 0.508)
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(priority 2)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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@ -12750,7 +12777,7 @@
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)
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)
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)
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(zone (net 4) (net_name +3V3) (layer B.Cu) (tstamp 5FC2D259) (hatch edge 0.508)
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(zone (net 4) (net_name +3V3) (layer B.Cu) (tstamp 5FD71E8C) (hatch edge 0.508)
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(priority 1)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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@ -12768,7 +12795,7 @@
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)
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)
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)
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(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FC2D256) (hatch edge 0.508)
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(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FD71E89) (hatch edge 0.508)
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(priority 2)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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@ -13219,7 +13246,7 @@
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)
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)
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)
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(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FC2D253) (hatch edge 0.508)
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(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FD71E86) (hatch edge 0.508)
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(priority 1)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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@ -13419,7 +13446,7 @@
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)
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)
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)
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(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FC2D250) (hatch edge 0.508)
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(zone (net 2) (net_name GND) (layer F.Cu) (tstamp 5FD71E83) (hatch edge 0.508)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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@ -15219,7 +15246,7 @@
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)
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)
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)
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(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FCB29E1) (hatch edge 0.508)
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(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FD71E80) (hatch edge 0.508)
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(priority 1)
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(connect_pads (clearance 0.25))
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(min_thickness 0.254)
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@ -15324,7 +15351,7 @@
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)
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)
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)
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(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FC2D24A) (hatch edge 0.508)
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(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5FD71E7D) (hatch edge 0.508)
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(priority 2)
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||||
(connect_pads (clearance 0.25))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -15526,7 +15553,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 3) (net_name +8V) (layer F.Cu) (tstamp 5FC2D247) (hatch edge 0.508)
|
||||
(zone (net 3) (net_name +8V) (layer F.Cu) (tstamp 5FD71E7A) (hatch edge 0.508)
|
||||
(priority 3)
|
||||
(connect_pads (clearance 0.4))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -15653,7 +15680,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FC2D244) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FD71E77) (hatch edge 0.508)
|
||||
(connect_pads (clearance 0.25))
|
||||
(min_thickness 0.254)
|
||||
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
|
|
@ -15668,7 +15695,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FC2D241) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FD71E74) (hatch edge 0.508)
|
||||
(connect_pads (clearance 0.25))
|
||||
(min_thickness 0.254)
|
||||
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
|
|
@ -15683,7 +15710,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FC2D23E) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name Earth) (layer B.Cu) (tstamp 5FD71E71) (hatch edge 0.508)
|
||||
(connect_pads (clearance 0.25))
|
||||
(min_thickness 0.254)
|
||||
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
|
|
@ -15698,7 +15725,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FC2D23B) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name Earth) (layer F.Cu) (tstamp 5FD71E6E) (hatch edge 0.508)
|
||||
(connect_pads (clearance 0.25))
|
||||
(min_thickness 0.254)
|
||||
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
|
|
@ -15713,7 +15740,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 0) (hatch edge 0.508)
|
||||
(zone (net 4) (net_name +3V3) (layer F.Cu) (tstamp 5FD71E6B) (hatch edge 0.508)
|
||||
(priority 3)
|
||||
(connect_pads (clearance 0.25))
|
||||
(min_thickness 0.254)
|
||||
|
|
|
|||
|
|
@ -1,4 +1,4 @@
|
|||
update=Fri 27 Nov 2020 09:45:33 PM CET
|
||||
update=Sun 13 Dec 2020 06:44:17 PM CET
|
||||
version=1
|
||||
last_client=kicad
|
||||
[general]
|
||||
|
|
@ -74,8 +74,8 @@ OthersTextSizeH=1
|
|||
OthersTextSizeThickness=0.15
|
||||
OthersTextItalic=0
|
||||
OthersTextUpright=1
|
||||
SolderMaskClearance=0.051
|
||||
SolderMaskMinWidth=0.25
|
||||
SolderMaskClearance=0
|
||||
SolderMaskMinWidth=0
|
||||
SolderPasteClearance=0
|
||||
SolderPasteRatio=-0
|
||||
[pcbnew/Layer.F.Cu]
|
||||
|
|
|
|||
Loading…
Reference in New Issue