add GND points near test points to get good ground connection

This commit is contained in:
Mario Hüttel 2020-02-18 20:37:26 +01:00
parent 3629ac7581
commit e60811b49b
2 changed files with 201 additions and 57 deletions

View File

@ -1105,4 +1105,76 @@ Wire Wire Line
5150 1750 5500 1750
Text Label 2800 1200 0 50 ~ 0
VREF_OP
$Comp
L Connector:TestPoint TP304
U 1 1 5E5831F5
P 1950 850
F 0 "TP304" H 2008 968 50 0000 L CNN
F 1 "GND" H 2008 877 50 0000 L CNN
F 2 "TestPoint:TestPoint_Pad_D1.5mm" H 2150 850 50 0001 C CNN
F 3 "~" H 2150 850 50 0001 C CNN
1 1950 850
1 0 0 -1
$EndComp
Wire Wire Line
1950 850 1950 2100
$Comp
L power:GND #PWR0137
U 1 1 5E591524
P 1950 2100
F 0 "#PWR0137" H 1950 1850 50 0001 C CNN
F 1 "GND" H 1955 1927 50 0000 C CNN
F 2 "" H 1950 2100 50 0001 C CNN
F 3 "" H 1950 2100 50 0001 C CNN
1 1950 2100
1 0 0 -1
$EndComp
$Comp
L Connector:TestPoint TP305
U 1 1 5E59C2BA
P 4900 2450
F 0 "TP305" H 4958 2568 50 0000 L CNN
F 1 "GND" H 4958 2477 50 0000 L CNN
F 2 "TestPoint:TestPoint_Pad_D1.5mm" H 5100 2450 50 0001 C CNN
F 3 "~" H 5100 2450 50 0001 C CNN
1 4900 2450
1 0 0 -1
$EndComp
Wire Wire Line
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$Comp
L power:GND #PWR0138
U 1 1 5E5A4A2B
P 4900 2700
F 0 "#PWR0138" H 4900 2450 50 0001 C CNN
F 1 "GND" H 4905 2527 50 0000 C CNN
F 2 "" H 4900 2700 50 0001 C CNN
F 3 "" H 4900 2700 50 0001 C CNN
1 4900 2700
1 0 0 -1
$EndComp
$Comp
L Connector:TestPoint TP306
U 1 1 5E5AA625
P 6800 3550
F 0 "TP306" H 6858 3668 50 0000 L CNN
F 1 "GND" H 6858 3577 50 0000 L CNN
F 2 "TestPoint:TestPoint_Pad_D1.5mm" H 7000 3550 50 0001 C CNN
F 3 "~" H 7000 3550 50 0001 C CNN
1 6800 3550
1 0 0 -1
$EndComp
Wire Wire Line
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$Comp
L power:GND #PWR0139
U 1 1 5E5B26A6
P 6800 3600
F 0 "#PWR0139" H 6800 3350 50 0001 C CNN
F 1 "GND" H 6805 3427 50 0000 C CNN
F 2 "" H 6800 3600 50 0001 C CNN
F 3 "" H 6800 3600 50 0001 C CNN
1 6800 3600
1 0 0 -1
$EndComp
$EndSCHEMATC

View File

@ -2,10 +2,10 @@
(general
(thickness 1.6)
(drawings 90)
(drawings 99)
(tracks 1761)
(zones 0)
(modules 128)
(modules 131)
(nets 138)
)
@ -61,7 +61,7 @@
(mod_edge_width 0.12)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 0.7874 0.7874)
(pad_size 1.5 1.5)
(pad_drill 0)
(pad_to_mask_clearance 0.051)
(solder_mask_min_width 0.25)
@ -395,6 +395,69 @@
(add_net /N_IN)
)
(module TestPoint:TestPoint_Pad_D1.5mm (layer F.Cu) (tedit 5E4C3C37) (tstamp 5E4CFE9F)
(at 82.75 83.5)
(descr "SMD pad as test Point, diameter 1.5mm")
(tags "test point SMD pad")
(path /5D8C5188/5E5AA625)
(attr virtual)
(fp_text reference TP306 (at 1.75 -0.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value GND (at 0 1.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 0 0.95) (layer F.SilkS) (width 0.12))
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 1.25 2.25) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers F.Cu F.Mask)
(net 2 GND) (zone_connect 2))
)
(module TestPoint:TestPoint_Pad_D1.5mm (layer F.Cu) (tedit 5E4C3C60) (tstamp 5E4CFE97)
(at 65.75 89.5)
(descr "SMD pad as test Point, diameter 1.5mm")
(tags "test point SMD pad")
(path /5D8C5188/5E59C2BA)
(attr virtual)
(fp_text reference TP305 (at -3 -1 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value GND (at 0 1.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 0 0.95) (layer F.SilkS) (width 0.12))
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 -1.65) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers F.Cu F.Mask)
(net 2 GND) (zone_connect 2))
)
(module TestPoint:TestPoint_Pad_D1.5mm (layer F.Cu) (tedit 5E4C3C13) (tstamp 5E4CFE8F)
(at 64 105)
(descr "SMD pad as test Point, diameter 1.5mm")
(tags "test point SMD pad")
(path /5D8C5188/5E5831F5)
(attr virtual)
(fp_text reference TP304 (at -4 2.25) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value GND (at 0 1.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 0 0.95) (layer F.SilkS) (width 0.12))
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 -1.65) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers F.Cu F.Mask)
(net 2 GND) (zone_connect 2))
)
(module shimatta_artwork:shimatta_kanji_20mm_solder_mask (layer B.Cu) (tedit 0) (tstamp 5E4C6208)
(at 41.5 29.75 180)
(fp_text reference G*** (at 0 0) (layer B.SilkS) hide
@ -1145,7 +1208,7 @@
(tags SOT-23)
(path /5D8C5188/5E5592F3)
(attr smd)
(fp_text reference U302 (at 0 -2.5 90) (layer F.SilkS)
(fp_text reference U302 (at -1.5 -2.5 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TL431LI-DBZ (at 0 2.5 90) (layer F.Fab)
@ -6509,6 +6572,15 @@
)
)
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@ -8146,15 +8218,14 @@
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